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flashmemory.png B1_bannerph.jpg

晶圆级封装（WLCSP）

概述

果博官网 SPI NOR Flash 和 SPI NAND Flash 提供 4Mb至 2Gb 的晶圆级封装（WLCSP，，，Wafer Level Chip Scale Packaging）版本。。。。。与古板塑料封装差别，，，WLCSP 是一种晶圆级封装，，，其封装尺寸与裸芯片相同。。。。。果博官网最小 WLCSP 封装尺寸长度和宽度均可低于 1mm，，，厚度仅 0.25mm，，，为紧凑型电路板设计提供了显著的尺寸优势。。。。。同时，，，WLCSP 封装还可改善芯片的散热性能，，，提高数据传输的稳固性。。。。。 

从小型化到低功耗，，，果博官网通过 WLCSP 封装突破了存储器器件的物理限制，，，现在已被普遍应用于可衣着装备等领域。。。。。随着微型化市场需求的生长，，，WLCSP 封装将继续成为目今及未来主要的封装形式之一。。。。。

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    40个效果

    • 电压

      • 1.2V

      • 1.65V~3.6V

      • 1.8V

      • 1.8V VCC, 1.2V VIO

    • 容量

      • 2Mb

      • 4Mb

      • 8Mb

      • 16Mb

      • 32Mb

      • 64Mb

      • 128Mb

      • 256Mb

      • 512Mb

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    Part No
    果博·(中国游)官方网站-App Store
    状态
    果博·(中国游)官方网站-App Store
    电压
    果博·(中国游)官方网站-App Store
    容量
    果博·(中国游)官方网站-App Store
    温度(工规)
    果博·(中国游)官方网站-App Store
    频率(MHz)
    果博·(中国游)官方网站-App Store
    主要特征
    果博·(中国游)官方网站-App Store
    主要封装
    MP1.8V512Mb-40℃~85℃,-40℃~105℃,-40℃~125℃200(x1 x8),200(x8 DTR)ECC,H/W RESET,WP#,Secured OTPSOP16 300mil,TFBGA24 5x5 ball array,WLCSP (4x6 ball array)
    MP1.2V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 208mil,SOP16 300mil,WSON8 6x5mm,WSON8 8x6mm,WLCSP (4-4 ball array)
    MP1.8V VCC, 1.2V VIO256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)H/W RESET,Secured OTP,SuspendTFBGA24 5x5 ball array
    MP1.8V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃200(x1 x8),200(x8 DTR)ECC,H/W RESET,WP#,Secured OTPSOP16 300mil,TFBGA24 5x5 ball array,WLCSP (4x6 ball array)
    MP1.8V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃166(x1 x2 x4),104(x4 DTR)H/W RESET,WP#,Secured OTP,SuspendWSON8 6x5mm,WLCSP (4-4 ball array)
    MP1.2V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 208mil,USON8 4x4mm,WSON8 6x5mm,TFBGA24 5x5 ball array,WLCSP (4-4 ball array)
    MP1.65V~3.6V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4),66(x4 DTR)H/W RESET,WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,WLCSP (4-4 ball array)
    MP1.8V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4)H/W RESET,WP#,Secured OTP,SuspendSOP8 208mil,USON8 4x4mm,WSON8 6x5mm,WSON8 8x6mm
    MP1.8V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)H/W RESET,WP#,Secured OTP,SuspendFO-USON8 3x3mm,USON8 4x4mm,WSON8 6x5mm,VSOP8 208mil,WLCSP (4-4 ball array)
    MP1.2V64Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 208mil,USON8 3x4mm,USON8 4x4mm,WLCSP (4-4 ball array)
    MP1.65V~3.6V64Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 208mil,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,WLCSP (3-2-3 ball array)
    MP1.65V~3.6V64Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4),66(x4 DTR)H/W RESET,WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,WLCSP (4-4 ball array),FO-USON8 3x2mm
    MP1.8V64Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)WP#,Secured OTP,SuspendSOP8 208mil,USON8 3x4mm,FO-USON8 3x2mm,USON8 4x4mm,WLCSP (4-4 ball array)
    MP1.8V64Mb-40℃~85℃,-40℃~105℃,-40℃~125℃166(x1 x2 x4),104(x2 x4 DTR)WP#,Secured OTP,SuspendUSON8 3x4mm,FO-USON8 3x2mm,USON8 4x4mm,WLCSP (4-4 ball array)
    MP1.2V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 150mil,SOP8 208mil,USON8 3x2mm,USON8 3x4mm,WLCSP (3-2-3 ball array)
    MP1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 208mil,USON8 3x2mm,USON8 3x4mm
    MP1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)WP#,Secured OTP,SuspendUSON8 3x2mm,USON8 3x4mm,USON8 4x4mm,WLCSP (4-4 ball array),WLCSP (3-2-3 ball array)
    MP1.2V16Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 150mil,SOP8 208mil,USON8 3x2mm,USON8 3x4mm,WLCSP (3-2-3 ball array)
    MP1.8V16Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,USON8 3x2mm,USON8 3x4mm,WLCSP (3-2-3 ball array)
    MP1.8V16Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)WP#,Secured OTP,SuspendSOP8 208mil,USON8 3x2mm,WLCSP (3-2-3 ball array)
    MP1.2V8Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 150mil,SOP8 208mil,USON8 3x2mm,WLCSP (4-4 ball array)
    MP1.8V8Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)WP#,Secured OTP,SuspendSOP8 150mil,USON8 3x2mm,WLCSP (4-4 ball array)
    MP1.65V~3.6V4Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 150mil,USON8 1.5x1.5mm,USON8 3x2mm,WLCSP (4x6 ball array)
    MP1.65V~3.6V2Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 150mil,USON8 3x2mm,USON8 1.5x1.5mm,WLCSP (2x3 ball array)
    UD1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃166(x1 x2 x4),104(x2 x4 DTR)WP#,Secured OTP,SuspendUSON8 3x2mm,USON8 3x4mm,WLCSP (3-2-3 ball array)
    NR1.8V512Mb-40℃~85℃,-40℃~105℃,-40℃~125℃166(x1 x4),90(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP16 300mil,WSON8 8x6mm,TFBGA24 5x5 ball array,WLCSP (3-2-3 ball array)
    NR1.8V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃166(x1 x4),104(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPWSON8 6x5mm,WSON8 8x6mm,TFBGA24 5x5 ball array,WLCSP (4-4 ball array),WLCSP (3-2-3 ball array)
    NR1.8V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃166(x1 x2 x4),104(x4 DTR)Default 4I/O,H/W RESET,Secured OTP,SuspendWSON8 6x5mm,WLCSP (4-4 ball array)
    NR1.8V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4)H/W RESET,WP#,Secured OTP,SuspendWSON8 6x5mm,WLCSP (4-4 ball array)
    NR1.8V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 208mil,VSOP8 208mil,WSON8 6x5mm,WSON8 8x6mm,WLCSP (4-4 ball array)
    NR1.8V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4)Default 4I/O,Secured OTP,SuspendSOP8 208mil,VSOP8 208mil,WSON8 6x5mm,WLCSP (4-4 ball array)
    NR1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 208mil,USON8 3x4mm,WLCSP (4-4 ball array)
    NR1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4)WP#,Secured OTP,SuspendUSON8 3x4mm,USON8 4x4mm,WLCSP (4-4 ball array)
    NR1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4)Default 4I/O,Secured OTP,SuspendSOP8 208mil,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm
    NR1.8V16Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,USON8 3x4mm
    NR1.8V16Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 208mil
    NR1.8V8Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,USON8 3x2mm,WSON8 6x5mm
    NR1.8V8Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 150mil,USON8 3x2mm,WLCSP (4-4 ball array)
    NR1.65V~3.6V4Mb-40℃~85℃,-40℃~105℃,-40℃~125℃100(x1),80(x2)WP#SOP8 150mil,USON8 1.5x1.5mm,USON8 3x2mm,WLCSP (4-4 ball array)
    NR1.65V~3.6V2Mb-40℃~85℃,-40℃~105℃,-40℃~125℃100(x1),80(x2)WP#SOP8 150mil,USON8 1.5x1.5mm,USON8 3x2mm,WLCSP (4-4 ball array)

    状态说明：MP：量产阶段，，，UD：开发中，，，S：样品阶段，，，NR：不推荐

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