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1.2V & 1.2V VlO Serial NOR Flash
果博官网 GD25UF系列SPI NOR Flash事情电压极低，，，，仅为1.14V至1.26V，，，，特殊适用于接纳1.2V焦点电压的先进SoC和处置惩罚器。。。这不但简化了电源设计，，，，还支持GD25UF与主控装备之间的直接I/O接口。。。
GD25UF系列支持两种事情模式：正常模式和低功耗模式。。。与古板的1.8V SPI NOR Flash相比，，，，GD25UF在正常模式下功耗降低高达33%，，，，而在低功耗模式下，，，，功耗在相同频率条件下降低高达70%。。。
精彩的能效体现极大延伸了电池续航时间，，，，使GD25UF系列成为可衣着装备、智能家居及其他电池供电物联网（IoT）应用的理想选择。。。
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15 Results
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电压
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1.2V
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1.8V VCC, 1.2V VIO
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容量
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8Mb
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16Mb
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32Mb
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64Mb
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128Mb
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256Mb
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512Mb
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1Gb
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2Gb
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Part No
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状态
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电压
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容量
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温度(工规)
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频率(MHz)
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主要特征
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主要封装
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|---|---|---|---|---|---|---|---|
| MP | 1.8V VCC, 1.2V VIO | 2Gb | -40℃~85℃,-40℃~105℃,-40℃~125℃ | 166(x1 x2 x4),104(x2 x4 DTR) | PASSWORD,CRC,ECC,Default 4I/O,H/W RESET,WP#,Secured OTP,Suspend | SOP16 300mil,TFBGA24 5x5 ball array | |
| MP | 1.8V VCC, 1.2V VIO | 1Gb | -40℃~85℃,-40℃~105℃,-40℃~125℃ | 166(x1 x2 x4),104(x2 x4 DTR) | PASSWORD,CRC,ECC,Default 4I/O,H/W RESET,WP#,Secured OTP,Suspend | SOP16 300mil,TFBGA24 5x5 ball array | |
| MP | 1.8V VCC, 1.2V VIO | 512Mb | -40℃~85℃,-40℃~105℃,-40℃~125℃ | 166(x1 x2 x4),104(x2 x4 DTR) | PASSWORD,CRC,ECC,Default 4I/O,H/W RESET,WP#,Secured OTP,Suspend | SOP16 300mil,TFBGA24 5x5 ball array | |
| MP | 1.8V VCC, 1.2V VIO | 256Mb | -40℃~85℃,-40℃~105℃,-40℃~125℃ | 166(x1 x2 x4),104(x2 x4 DTR) | PASSWORD,CRC,ECC,Default 4I/O,H/W RESET,WP#,Secured OTP,Suspend | SOP16 300mil,TFBGA24 5x5 ball array | |
| MP | 1.8V VCC, 1.2V VIO | 256Mb | -40℃~85℃,-40℃~105℃,-40℃~125℃ | 133(x1 x2 x4),104(x4 DTR) | H/W RESET,Secured OTP,Suspend | TFBGA24 5x5 ball array | |
| MP | 1.2V | 128Mb | -40℃~85℃,-40℃~105℃,-40℃~125℃ | 120(x1 x2 x4),80(x4 DTR) | Default 4I/O,H/W RESET,WP#,Secured OTP | SOP8 208mil,USON8 4x4mm,WSON8 6x5mm,TFBGA24 5x5 ball array,WLCSP (4-4 ball array) | |
| MP | 1.8V VCC, 1.2V VIO | 128Mb | -40℃~85℃,-40℃~105℃,-40℃~125℃ | 200(x1 x8),200(x8 DTR) | ECC,H/W RESET,WP#,Secured OTP | TFBGA24 5x5 ball array | |
| MP | 1.2V | 64Mb | -40℃~85℃,-40℃~105℃,-40℃~125℃ | 120(x1 x2 x4),80(x4 DTR) | Default 4I/O,H/W RESET,WP#,Secured OTP | SOP8 208mil,USON8 3x4mm,USON8 4x4mm,WLCSP (4-4 ball array) | |
| MP | 1.8V VCC, 1.2V VIO | 64Mb | -40℃~85℃,-40℃~105℃,-40℃~125℃ | 200(x1 x8),200(x8 DTR) | ECC,H/W RESET,WP#,Secured OTP | TFBGA24 5x5 ball array | |
| MP | 1.2V | 32Mb | -40℃~85℃,-40℃~105℃,-40℃~125℃ | 120(x1 x2 x4),80(x4 DTR) | Default 4I/O,H/W RESET,WP#,Secured OTP | SOP8 150mil,SOP8 208mil,USON8 3x2mm,USON8 3x4mm,WLCSP (3-2-3 ball array) | |
| MP | 1.2V | 16Mb | -40℃~85℃,-40℃~105℃,-40℃~125℃ | 120(x1 x2 x4),80(x4 DTR) | Default 4I/O,H/W RESET,WP#,Secured OTP | SOP8 150mil,SOP8 208mil,USON8 3x2mm,USON8 3x4mm,WLCSP (3-2-3 ball array) | |
| MP | 1.2V | 8Mb | -40℃~85℃,-40℃~105℃,-40℃~125℃ | 120(x1 x2 x4),80(x4 DTR) | Default 4I/O,H/W RESET,WP#,Secured OTP | SOP8 150mil,SOP8 208mil,USON8 3x2mm,WLCSP (4-4 ball array) | |
| S | 1.2V | 256Mb | -40℃~85℃,-40℃~105℃,-40℃~125℃ | 120(x1 x2 x4),80(x4 DTR) | Default 4I/O,H/W RESET,WP#,Secured OTP | SOP8 208mil,SOP16 300mil,WSON8 6x5mm,WLCSP (4-4 ball array) | |
| S | 1.8V VCC, 1.2V VIO | 128Mb | -40℃~85℃ | 133(x1 x2 x4),104(x2 x4 DTR) | H/W RESET,Suspend | SOP16 300mil,TFBGA24 5x5 ball array | |
| S | 1.8V VCC, 1.2V VIO | 128Mb | -40℃~85℃ | 166(x1 x2 x4),104(x4 DTR) | ECC,Default 4I/O,H/W RESET,Secured OTP,Suspend | SOP16 300mil,TFBGA24 5x5 ball array |
状态说明：MP：量产阶段，，，，UD：开发中，，，，S：样品阶段，，，，NR：不推荐
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