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flashmemory.png B1_bannerph.jpg

晶圆级封装（WLCSP）

概述

果博官网 SPI NOR Flash 和 SPI NAND Flash 提供 4Mb至 2Gb 的晶圆级封装（WLCSP， ，Wafer Level Chip Scale Packaging）版本。。与古板塑料封装差别， ，WLCSP 是一种晶圆级封装， ，其封装尺寸与裸芯片相同。。果博官网最小 WLCSP 封装尺寸长度和宽度均可低于 1mm， ，厚度仅 0.25mm， ，为紧凑型电路板设计提供了显著的尺寸优势。。同时， ，WLCSP 封装还可改善芯片的散热性能， ，提高数据传输的稳固性。。 

从小型化到低功耗， ，果博官网通过 WLCSP 封装突破了存储器器件的物理限制， ，现在已被普遍应用于可衣着装备等领域。。随着微型化市场需求的生长， ，WLCSP 封装将继续成为目今及未来主要的封装形式之一。。

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    39个效果

    • 电压

      • 1.2V

      • 1.65V~3.6V

      • 1.8V

      • 1.8V VCC, 1.2V VIO

    • 容量

      • 2Mb

      • 4Mb

      • 8Mb

      • 16Mb

      • 32Mb

      • 64Mb

      • 128Mb

      • 256Mb

      • 512Mb

    Loading
    Part No
    果博·(中国游)官方网站-App Store
    状态
    果博·(中国游)官方网站-App Store
    电压
    果博·(中国游)官方网站-App Store
    容量
    果博·(中国游)官方网站-App Store
    温度(工规)
    果博·(中国游)官方网站-App Store
    频率(MHz)
    果博·(中国游)官方网站-App Store
    主要特征
    果博·(中国游)官方网站-App Store
    主要封装
    MP1.8V512Mb-40℃~85℃,-40℃~105℃,-40℃~125℃200(x1 x8),200(x8 DTR)ECC,H/W RESET,WP#,Secured OTPSOP16 300mil,TFBGA24 5x5 ball array,WLCSP (4x6 ball array)
    MP1.8V VCC, 1.2V VIO256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)H/W RESET,Secured OTP,SuspendTFBGA24 5x5 ball array
    MP1.8V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃200(x1 x8),200(x8 DTR)ECC,H/W RESET,WP#,Secured OTPSOP16 300mil,TFBGA24 5x5 ball array,WLCSP (4x6 ball array)
    MP1.8V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃166(x1 x2 x4),104(x4 DTR)H/W RESET,WP#,Secured OTP,SuspendWSON8 6x5mm,WLCSP (4-4 ball array)
    MP1.2V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 208mil,USON8 4x4mm,WSON8 6x5mm,TFBGA24 5x5 ball array,WLCSP (4-4 ball array)
    MP1.65V~3.6V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4),66(x4 DTR)H/W RESET,WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,WLCSP (4-4 ball array)
    MP1.8V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4)H/W RESET,WP#,Secured OTP,SuspendSOP8 208mil,USON8 4x4mm,WSON8 6x5mm,WSON8 8x6mm
    MP1.8V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)H/W RESET,WP#,Secured OTP,SuspendFO-USON8 3x3mm,USON8 4x4mm,WSON8 6x5mm,VSOP8 208mil,WLCSP (4-4 ball array)
    MP1.2V64Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 208mil,USON8 3x4mm,USON8 4x4mm,WLCSP (4-4 ball array)
    MP1.65V~3.6V64Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 208mil,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,WLCSP (3-2-3 ball array)
    MP1.65V~3.6V64Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4),66(x4 DTR)H/W RESET,WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,WLCSP (4-4 ball array),FO-USON8 3x2mm
    MP1.8V64Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 208mil,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,WLCSP (4-4 ball array)
    MP1.8V64Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)WP#,Secured OTP,SuspendSOP8 208mil,USON8 3x4mm,FO-USON8 3x2mm,USON8 4x4mm,WLCSP (4-4 ball array)
    MP1.2V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 150mil,SOP8 208mil,USON8 3x2mm,USON8 3x4mm,WLCSP (3-2-3 ball array)
    MP1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 208mil,USON8 3x2mm,USON8 3x4mm,WLCSP (4-4 ball array),WLCSP (3-2-3 ball array)
    MP1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)WP#,Secured OTP,SuspendUSON8 3x2mm,USON8 3x4mm,USON8 4x4mm,WLCSP (4-4 ball array),WLCSP (3-2-3 ball array)
    MP1.2V16Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 150mil,SOP8 208mil,USON8 3x2mm,USON8 3x4mm,WLCSP (3-2-3 ball array)
    MP1.8V16Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,USON8 3x2mm,USON8 3x4mm,WLCSP (3-2-3 ball array)
    MP1.8V16Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)WP#,Secured OTP,SuspendSOP8 208mil,USON8 3x2mm,WLCSP (3-2-3 ball array)
    MP1.2V8Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 150mil,SOP8 208mil,USON8 3x2mm,WLCSP (4-4 ball array)
    MP1.8V8Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)WP#,Secured OTP,SuspendSOP8 150mil,USON8 3x2mm,WLCSP (4-4 ball array)
    MP1.65V~3.6V4Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 150mil,USON8 1.5x1.5mm,USON8 3x2mm,WLCSP (4x6 ball array)
    MP1.65V~3.6V2Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 150mil,USON8 3x2mm,USON8 1.5x1.5mm,WLCSP (2x3 ball array)
    S1.2V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 208mil,SOP16 300mil,WSON8 6x5mm,WLCSP (4-4 ball array)
    NR1.8V512Mb-40℃~85℃,-40℃~105℃,-40℃~125℃166(x1 x4),90(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP16 300mil,WSON8 8x6mm,TFBGA24 5x5 ball array,WLCSP (3-2-3 ball array)
    NR1.8V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃166(x1 x4),104(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPWSON8 6x5mm,WSON8 8x6mm,TFBGA24 5x5 ball array,WLCSP (4-4 ball array),WLCSP (3-2-3 ball array)
    NR1.8V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃166(x1 x2 x4),104(x4 DTR)Default 4I/O,H/W RESET,Secured OTP,SuspendWSON8 6x5mm,WLCSP (4-4 ball array)
    NR1.8V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4)H/W RESET,WP#,Secured OTP,SuspendWSON8 6x5mm,WLCSP (4-4 ball array)
    NR1.8V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 208mil,VSOP8 208mil,WSON8 6x5mm,WSON8 8x6mm,WLCSP (4-4 ball array)
    NR1.8V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4)Default 4I/O,Secured OTP,SuspendSOP8 208mil,VSOP8 208mil,WSON8 6x5mm,WLCSP (4-4 ball array)
    NR1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 208mil,USON8 3x4mm,WLCSP (4-4 ball array)
    NR1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4)WP#,Secured OTP,SuspendUSON8 3x4mm,USON8 4x4mm,WLCSP (4-4 ball array)
    NR1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4)Default 4I/O,Secured OTP,SuspendSOP8 208mil,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm
    NR1.8V16Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,USON8 3x4mm
    NR1.8V16Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 208mil
    NR1.8V8Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,USON8 3x2mm,WSON8 6x5mm
    NR1.8V8Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 150mil,USON8 3x2mm,WLCSP (4-4 ball array)
    NR1.65V~3.6V4Mb-40℃~85℃,-40℃~105℃,-40℃~125℃100(x1),80(x2)WP#SOP8 150mil,USON8 1.5x1.5mm,USON8 3x2mm,WLCSP (4-4 ball array)
    NR1.65V~3.6V2Mb-40℃~85℃,-40℃~105℃,-40℃~125℃100(x1),80(x2)WP#SOP8 150mil,USON8 1.5x1.5mm,USON8 3x2mm,WLCSP (4-4 ball array)

    状态说明：MP：量产阶段， ，UD：开发中， ，S：样品阶段， ，NR：不推荐

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